Semiconductor
Core Applications
Silicon Through‑Hole (TSV) processing in semiconductor chip packaging, laser welding of chip packages, laser cutting and trimming of pins, and wafer dicing.
Technical Value
Ultrafast lasers are used for cold processing, with the heat-affected zone kept within 5 μm to prevent material damage and ensure the integrity of chip signal transmission, making it suitable for advanced processes such as 2.5D/3D packaging.
Typical scenarios
Femtosecond laser processing of TSV vias with an aspect ratio of 1:10, laser annealing of semiconductor power devices, and laser marking for chip package traceability.
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Official Email:sales@yosoon.cn
Headquarters Address: No. 521, Zhujiang Road, Huqiu District, Suzhou City, Jiangsu Province
Production Base: No. 1777, Dongwu Road, Economic Development Zone, Suqian City, Jiangsu Province