PCB Microelectronics
Core Applications
High-Density Interconnect (HDI) microvia drilling, blind via fabrication on flexible printed circuits (FPC), thermal vias in ceramic substrates, and the formation of non‑standard holes (square holes / angled holes).
Technical Value
Breaking the limits of mechanical machining, the minimum hole diameter can reach 10 μm, with a hole wall roughness of ≤0.5 μm. Machining efficiency is more than three times higher than that of mechanical drilling, supporting high‑end PCB manufacturing for 5G base stations, new energy vehicle electronics, and other applications.
Typical scenarios
UV laser processing for HDI boards with 20 layers or more, including 0.05 mm blind vias; ultrafast laser treatment of high‑frequency boards (PTFE material) to prevent delamination; and laser direct patterning of circuit traces on PCBs.
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Service Hotline:+86 195 2273 7631
Official Email:sales@yosoon.cn
Headquarters Address: No. 521, Zhujiang Road, Huqiu District, Suzhou City, Jiangsu Province
Production Base: No. 1777, Dongwu Road, Economic Development Zone, Suqian City, Jiangsu Province