How to Choose Various Types of Laser Equipment?
11/11
2021
The laser devices currently more widely used in the Chinese market include: fiber laser marking machines, UV laser marking machines, CO2 laser marking machines, picosecond laser marking machines, and femtosecond laser marking machines. However, among these three types—fiber, UV, and CO2 laser marking machines—they are the mainstream options currently available in China’s market. Laser marking equipment …covering almost all types of financial product labeling and packaging applications. While their applications differ, this leads to varying development trajectories in their respective fields. The primary differences—and also the key distinctions—lie in their underlying principles as well as in the structural composition of their essential core components. Today, we’ll be introducing these to you. Laser equipment The main ways in which they differ.
1. The Core Component of Laser Equipment: the Laser
Fiber laser marking machine: Uses a 1064 nm wavelength laser.
UV Laser Marking Machine: This machine utilizes a 355 nm UV laser. Compared to infrared lasers, the 355 nm UV light produces an extremely small focused spot, significantly reducing mechanical deformation of consumables and exerting minimal thermal effects on the material being processed. As for laser wavelength, the shorter the wavelength, the smaller the laser’s focused spot and the higher the precision. During the machining process, the resulting heat-affected zone is smaller, leading to better processing results.
2. Comparison of Advantages Between Fiber Laser Marking Machines and UV Laser Marking Machines
1. On the other side of the spectrum, ultraviolet lasers have shorter wavelengths than visible light (which is visible to the naked eye), allowing for more precise focusing and the creation of extremely fine circuit features while maintaining exceptional positioning accuracy.
2. The relatively low processing temperature, combined with the presence of high‑energy photons in ultraviolet light, makes it easy to apply large‑scale PCB assembly techniques. From standard materials such as FR4 to high‑frequency ceramic composites, as well as flexible PCB materials like polyimide, all are well suited for marking. The following table shows the absorption rates of common PCB materials under six different laser types. These six lasers include an excimer laser (wavelength 248 nm), an infrared laser (wavelength 1064 nm), and two carbon dioxide lasers (with wavelengths of 9.4 µm and 1.06 µm, respectively). The ultraviolet laser (Nd:YAG, 355 nm) is a rare laser that exhibits the same absorption rate across all three materials.
3. When used on resin and copper materials, ultraviolet laser marking machines exhibit extremely high absorption rates, and they also achieve an optimal absorption rate when processing glass. While excimer lasers (with a wavelength of 248 nm), which are relatively more expensive, deliver even better absorption performance when working with these materials, the inherent material differences make ultraviolet laser machines the preferred choice for many companies in industrial applications involving PCB material management. From the most fundamental circuit boards used in production and daily life—covering circuit design and wiring—to the fabrication of ultra‑small embedded system chips, the processes involved are generally comparable and widely applicable.
3. Laser equipment The processing method
The process of ultraviolet laser machining falls under the category of cold‑processing, meaning that relatively little heat is generated during machining. Ultraviolet light, with its high‑energy photons, can bombard the chemical composition of the material or the surrounding medium, causing damage to the material through non‑thermal processes. This approach prevents heat generation and thermal deformation in the surface layer and localized areas of the workpiece, making it ideally suited for precision machining or applications requiring high levels of accuracy. Fiber laser marking machines create marks by vaporizing the surface layer of the material via a laser beam, or by inducing surface material combustion—or triggering chemical and physical changes in the material—through light energy. These machines can produce etched patterns, barcodes, characters, logos, and other graphical elements, making them suitable for processing metal products as well as for marking certain non‑metallic materials.
4. Segmentation of Laser Equipment Application Fields
UV Laser Marking Machine: Used for ultra‑fine processing in high‑end markets. It is ideal for marking pharmaceuticals, cosmetics, polymer packaging, and packaging bottles—thanks to its delicate, clear markings that are extremely difficult to erase and far more environmentally friendly than inkjet coding. UV laser marking machines are well suited for marking flexible PCBs, dicing, drilling micro‑holes in silicon wafers, and creating blind vias. UV laser marking machines have found widespread application in these products.
Fiber laser marking machine: This… Laser equipment Suitable for marking and deep engraving on many metal surfaces. Although fiber lasers are not ideal for marking special materials due to the large amount of heat generated by the laser beam, they offer excellent cost performance.
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